at&s(chongqing) campusrecruitment in 2022
奥特斯科技(重庆)有限公司2022校园招聘
company profile公司简介
at&sisthe european market leader and one of the globally leading manufacturersofhigh-end ic substrates and high-value printed circuit boards.at&sindustrializes leading-edge technologies for its core business segmentsasmobile devices, automotive, industrial, medical and advanced ic packaging.
奥地利科技与系统技术股份公司（at&s）简称奥特斯，是欧洲以及全球领先的高端半导体封装载板和高密度互连印制电路板制造商。集团致力于生产具有前瞻性技术的产品，并将工业领域的核心市场定位于：移动设备、汽车和航天、工业电子、医疗与健康以及先进半导体封装领域。
as afastgrowing multinational company, at&s currently has six production basesinaustria and asia – austria: leoben (headquarter) and fehring; asia:nanjangudof india, ansan of korea, shanghai and chongqing of china.
作为一家迅速发展的跨国企业，奥特斯目前在奥地利本土和亚洲地区共拥有六个生产基地-奥地利：利奥本、菲岭；亚洲：印度南燕古德、韩国安山、中国上海和重庆。
establishedin 2011, at&s chongqing is located in chongqing liangjiang new areayufuindustrial park, and this is the second sole proprietorship enterpriseofat&s group established in china. at&s is currently investing intwocutting-edge technologies in chongqing, and started mass production inapr.2016. at&s chongqing produces the latest generation of high-endicsubstrates for the use in computer microprocessor, and hdi pcb for the useinmobile devices, wearable devices and high-end internet products. at&schongqinghas become the first high-end ic substrates manufacturer in china.
奥特斯科技（重庆）有限公司建立于2011年，是奥特斯集团在中国设立的第二家独资企业（工厂位于重庆市两江新区鱼复工业园区）。奥特斯目前在中国重庆工厂投资两大尖端技术，于2016年4月投产,生产全球领先的半导体封装载板和系统级封装印制电路板，产品应用于电脑微处理器、移动设备、可穿戴设备和高端物联网产品。奥特斯已成为中国唯一的新一代高端半导体封装载板制造商。
in jul.2019, at&s announced to invest nearly one billion euro for the next fiveyears to build a new plant in chongqing, which introduces the most advancedtechnology and equipment to produce new high-end ic substrates. the companyplans to start production in fiscal year 2021/22. the project adopts themainstream carrier board technology for current high-performance computingapplications, and the products are widely used in servers, personal computers,automobiles and 5g.
2019年奥特斯宣布扩产建设重庆三期项目，引进最先进的技术和设备，生产高端半导体封装载板，计划在2021/22财年启动生产。项目采用了目前高性能计算应用的主流载板技术，产品广泛适用于服务器、个人电脑、汽车和5g等领域。
positions招聘职位
--processengineertrainee(150)工艺工程师培训生
--fortdi/quality/production/maintenance/r&ddepartment工程技术部/质量部/生产部/设备维修部/研发部
requirements:
1. have an open mind and innovative thinking;开放性思维和创新意识
2. major in chemistry, materials, mechanicalengineering,microelectronics and so on;化学，材料，机械，微电子等相关专业
3. english?skills: cet-4 or above;英语技能：四级及以上
4. computer skills:?ms office software;熟练office办公软件
5.have motivation to develop in advancedmanufacturing industry andcapacibility for working under pressure.良好的抗压能力并致力于在先进制造行业长期发展
development andbenefit发展平台及福利
competitivebenefit,overseas training and development opportunity etc.
公司为您提供具有市场竞争力的薪酬福利，及出国培训发展机会等。
application e-mail简历投递邮箱:ccqcampus.hiring@cn.ats.net
contact us联系人：ashlyn yang,023-**** 6000-2658
